Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80986 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C10-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00 |
filingDate |
2010-07-01^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2014-12-10^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2014-12-10^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-5640083-B2 |
titleOfInvention |
Simplified copper-copper bonding method |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11362067-B2 |
priorityDate |
2009-07-03^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |