| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K37-0247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0876 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2012-05-31^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-6081993-B2 |
| titleOfInvention |
Wafer dicing using a hybrid galvanic laser scribing process with plasma etching |
| priorityDate |
2011-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |