| abstract |
NEW MATERIAL:A compound of formula I (R 2 is H, methyl, ethyl, n-undecyl, n-heptadecyl or phenyl; R 4 is H or methyl). n USE: A curing agent or curing promoter. n PREPARATION: The objective compound of the formula I can be obtained by heating a 4(5)-cyanoimidazole compound of formula II and dicyandiamide in a solvent such as DMSO in the presence of a caustic alkali. The raw material compound of the formula II can easily be obtained by dehydrosulfurization of a thiocarbamoylimidazole compound formed by reaction between imidazole- dithiocarboxylic acid and ammonia. n COPYRIGHT: (C)1991,JPO&Japio |