http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H04193991-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d50be8406161e92e9d8549ce58b275d6
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03
filingDate 1990-11-28^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1294ae5d9975099217424b78197917db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3da39d4ce845a2d4882e40358eaebc82
publicationDate 1992-07-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H04193991-A
titleOfInvention Sealing solution and method
abstract PURPOSE: To improve lubricity and corrosion resistance and to reduce contact resistance by treating a metallic material plated with Ni, Pd and Au with an org. solvent soln. contg. paraffin wax, isostearic acid, etc., as the essential components. n CONSTITUTION: An org. solvent soln. contg. 0.1-3wt.% paraffin wax and 0.05-3wt.% of ≥1 kind selected from isostearic acid, oxidized wax and oxidized petrolatum as the essential components is prepared, or a sealing soln. contg. 0.05-3wt.% of a chelating cyclic nitrogen compd. in addition to the soln. is prepared. A copper or iron-based metallic material having a Pd (alloy) plating on an Ni plating substrate layer and further an Au (alloy) plating thereon is treated with the sealing soln. to seal pinholes. n COPYRIGHT: (C)1992,JPO&Japio
priorityDate 1990-11-28^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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