| abstract |
PURPOSE: To obtain a semiconductor device having excellent thermal impact resistance and moisture resistance by providing steps of sealing a bump with first resin composition, and covering the first composition with second resin composition containing solvent while holding a state connected to an insulating board. n CONSTITUTION: A method of manufacturing a semiconductor device having an insulating board 13, a semiconductor element 11 face down-connected to wirings 14 formed on the board 13 through a bump 12, and resin composition 15 for sealing the bump 12, has steps of sealing the bump 12 with the composition 15, and covering the composition 15 with second resin composition 16 containing solvent while holding a state connected to the board 13. For example, a gap between the element 11 and the board 13 is immersed with epoxy resin 15 containing no solvent as first resin composition in a semicured state. Then, phenol curable epoxy resin 16 is used as the second composition, and the resins 15, 16 are, after the resin 15 is so covered as not to be exposed, simultaneously primarily cured. n COPYRIGHT: (C)1992,JPO&Japio |