http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05170901-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
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filingDate 1991-12-02^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da78baee2ade9baae6c6ad8e7ebc138b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fc688915e4d9d3858a7e870ad357099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c821969b67a1c4d1983a7c687e70832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c05e1481593cf7a7f31bbf076799e4
publicationDate 1993-07-09^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05170901-A
titleOfInvention Photosensitive resin manufacturing method
abstract (57) [Summary] (Modified) [Constitution] 100 mol% of a dicarboxylic acid component obtained by previously reacting a tetracarboxylic dianhydride with an alcohol compound having an acrylic group or a methacrylic group represented by the formula (1). And a diamine component consisting of 0.5 to 50 mol% of the diaminosiloxane represented by the formula (2) and 99.5 to 50 mol% of an aromatic diamine, are reacted with carbodiimides as a condensing agent, in relation to all acid components. A method for producing a photosensitive resin, wherein a required amount of a diamine component and a carbodiimide are added and reacted in predetermined stages in multiple stages, and the addition of diaminosiloxane is completed before the final stage of addition. [Effect] A high molecular weight polyamide can be obtained, and a photosensitive resin can be obtained which has extremely high sensitivity and which provides a cured film having excellent adhesion and low elastic modulus.
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priorityDate 1991-12-02^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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