| abstract |
(57) [Abstract] [Purpose] By applying heat, vacuum and mechanical pressure to the pre-laminated substrate, all air between the dry film and the surface of the printed circuit board or other substrate is removed, and the dry film is removed. It is an object of the present invention to provide an improved method and apparatus for perfectly matching circuit traces and substrate surface features. A two-part conveyor vacuum applicator, the first part of which is two end-to-end input conveyors 1 4, 16 and the other part 18 consist of a belt conveyor 20 and a vacuum laminator 22. The belt conveyor 20 utilizes an endless belt 50 having an opening 84 therein such that, in a vacuum stack of applicators, the movable lower platen of the vacuum laminator is an endless belt within the vacuum chamber range of the printed circuit board and the laminator to be stacked. Rise through opening 84 with a portion of the upper surface of the laminator and are sealable with the upper platen of the laminator. |