http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05283608-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 |
| filingDate | 1992-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1993-10-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H05283608-A |
| titleOfInvention | Resin-sealed semiconductor device and method for manufacturing resin-sealed semiconductor device |
| abstract | (57) [Summary] (Correction) [Purpose] To provide a highly reliable resin-sealed semiconductor device with a thin three-dimensional structure. [Structure] In the first aspect of the present invention, a sealing resin sheet 1; A plurality of lead components 2d connected to the semiconductor chip 4 are alternately laminated and integrally laminated to form a laminated structure. Further, in the second aspect of the present invention, the sealing resin sheets are arranged on the uppermost surface and the lowermost surface, and the sealing resin sheets and a plurality of lead structures respectively connected to the semiconductor chips are alternately laminated and integrated. Of the lead structure, and at least one set of leads is interconnected inside or outside the encapsulating resin sheet. In the third aspect of the present invention, the conductor pattern is arranged on the upper surface of the sealing resin sheet. In the fourth aspect of the present invention, the lead structure of the first aspect of the present invention is laminated, and the encapsulating resin sheet is disposed on the uppermost surface and the lowermost surface, and pressure molding is performed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002064179-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011181971-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6038133-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9529506-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7556983-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6863109-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003017979-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6881611-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7074646-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7622801-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7068519-B2 |
| priorityDate | 1992-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7681 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518007 |
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