http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06100762-A

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filingDate 1992-09-21^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1994-04-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H06100762-A
titleOfInvention Epoxy resin composition
abstract (57) [Abstract] [Purpose] To provide a resin composition for producing an optical semiconductor, which has little luminance deterioration, high heat resistance, and high reliability. [Structure] 1) Epoxy resin 2) Hardener 3) Resin composition containing a reaction product of an epoxy resin and a compound having a carboxyl group obtained by half-esterifying an organopolysiloxane containing an alcoholic hydroxyl group with an acid anhydride .
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