| abstract |
(57) [Summary] [Objective] A semiconductor device is manufactured by subdividing a chip carrier into a large number of functional substrates such as a signal connection substrate, a capacitor substrate, a resistor substrate, and a power supply substrate. Many substrates are manufactured and tested separately before being assembled. Substrate manufacturing and testing are conveniently performed in parallel, which reduces semiconductor device manufacturing time. [Structure] Each substrate 102, 103, 104, 105 has a top connecting layer and a bottom connecting layer. Each tie layer has multiple bond pads of the same pattern. Pads have the same design rules, It is formed using the manufacturing method for the structure, pitch, diameter and each layer. Due to this identity, different functional substrates can be electrically exchanged without changing the coupling layer. In this case, it may be necessary to change the inside of the substrate. |