| abstract |
(57) [Abstract] [Purpose] Realization of a structure and method for preventing metal diffusion between a noble metal layer and an adjacent non-noble metal layer, and in particular, a super barrier structure between copper and an adjacent noble metal layer. To provide a new structure and method for doing so. According to the present invention, the non-noble metal layer 16, the titanium layer 17, This is accomplished by sequentially depositing the molybdenum layer 18 and the layer 20 of noble metal or relatively less noble metal as the metal for interconnection. The present invention also provides It also concerns an improved multi-layered metal pad or structure for connecting to at least a portion of a pin, connector, or wiring to a substrate. |