| abstract |
(57) [Abstract] [Purpose] An object of the present invention is to provide a cream solder material which is unlikely to cause chipping and a reflow soldering method using the same in the manufacture of electronic circuit boards. [Structure] A cream solder material comprising tin, lead and bismuth in a solder powder of 55 to 80% by weight, a solid flux of 20 to 45% by weight, and a halogen of 0.1% by weight or less. |