| abstract |
(57) [Abstract] [PROBLEMS] To provide an apparatus and method by which the relative spatial position between the rotation axis of a grinding tool and the rotation axis of a work can be easily adjusted with high accuracy. A work holder 1 for a rotary grinding machine for grinding a semiconductor wafer 10, the work holder 1 having a working surface 9 facing a rotary grinding tool and on which a semiconductor wafer 10 to be processed is placed, , The piezoelectric element 2 for axially supporting the work holder 1. The piezoelectric elements 2 can be actuated independently of each other, their linear dimensions change during actuation, and the actuated piezoelectric elements 2 move the work holder up and down in the axial direction at the position where it supports the work holder 1. . |