http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0714483-A

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filingDate 1993-06-22^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6d6aa128656ce4eb931c6a08e73310d
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publicationDate 1995-01-17^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0714483-A
titleOfInvention Micro bimetal relay and manufacturing method thereof
abstract (57) [Summary] [Object] To provide a microbimetal relay having high electrical reliability and a method for manufacturing the same. A movable substrate having a first coefficient of thermal expansion, The metal layer 32 formed on the back surface of the movable substrate 28 and having a second coefficient of thermal expansion larger than the first coefficient of thermal expansion, and the heating means 14 provided on the movable substrate 28. The first contact layer 16, the fixed substrate 24 disposed above the first contact layer 16 at a position facing each other with a predetermined space therebetween, and the position of the fixed substrate 24 facing the first contact layer 16. And a second contact layer 20 disposed on the.
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priorityDate 1993-06-22^^<http://www.w3.org/2001/XMLSchema#date>
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