| abstract |
(57) [Abstract] [Purpose] To provide a copper foil for a printed wiring board, which has a high adhesive strength between the copper foil and the resin substrate and has excellent migration resistance, and to manufacture the copper foil for a printed wiring board. And a non-cyanide copper-zinc plating bath excellent in stability of a plating bath suitably used in this method, which is suitable for the surface treatment of a copper foil for a printed wiring board without using a highly toxic cyanide compound. [Constitution] Non-cyanide copper-zinc electroplating bath containing copper salt, zinc salt, oxycarboxylic acid or its salt, aliphatic dicarboxylic acid or its salt, and thiocyanic acid or its salt, and immersing the copper foil in this plating bath A surface treatment method of a copper foil for a printed wiring board, which comprises subjecting at least one surface of the copper foil to cathodic electrolysis to form a carbon-containing copper-zinc coating layer, and 40 to 90 atomic% of copper on at least one surface of the copper foil. , 5 to 5 zinc A copper foil for a printed wiring board having a carbon-containing copper-zinc coating layer containing 0 atomic% and 0.1 to 20 atomic% of carbon. |