http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07268068-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_097405822d505467fd50f7100022cd56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1994-04-04^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89a49ec4760731a9c316c51679b55920 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e993d7887ed02acd581d436f783c4e4b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_558aec49e07d7d96a1778b2ae884e3cd |
| publicationDate | 1995-10-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H07268068-A |
| titleOfInvention | Method for producing heat-resistant resin cured product |
| abstract | (57) [Abstract] [Purpose] It can be cured by heating at 100 to 200 ° C, water does not form as a by-product during curing, and after curing it has high heat aging resistance, chemical stability and mechanical stability. A method for obtaining a cured polymaleimide resin having excellent physical properties is provided. [Structure] A thermosetting resin composition containing the components (c) and (d) in an amount of 1 to 30% by weight is heat-cured at a temperature of 100 to 200 ° C. (A) Polymaleimide compound (b) Alkenylphenol compound having at least two alkenyl groups in one molecule and / or alkenylphenyl ether compound (c) Epoxy resin having at least two epoxy groups in one molecule (D) Epoxy resin curing agent |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018199156-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018199156-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0885752-A |
| priorityDate | 1994-04-04^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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