http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08250847-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc45703f67bc72a6db582867886fd5d5 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
filingDate | 1995-03-09^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46f7f572a977c4fcfc8f62f0771594a4 |
publicationDate | 1996-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H08250847-A |
titleOfInvention | Soldering method for electronic parts |
abstract | (57) [Abstract] [Purpose] To prevent flux from adhering to the printed circuit board in the electronic component soldering method. [Structure] After applying solder cream 2 to electrodes 3 on printed circuit board 1 by a screen method, a paper mask 4 that absorbs flux is attached to the upper surface of printed circuit board 1. Then, the electronic component 5 is mounted. The electronic component 5 is mounted with a mounting height (standoff) corresponding to the thickness of the paper mask 4. Solder cream 2 is heated and soldered. At this time, since the flux is absorbed by the paper mask 4, it does not adhere to the printed board 1. Next, the paper mask 4 is removed from the printed board 1. At this time, the notch 7 of the paper mask 4 is expanded to form one opening together with the opening 6, and the electronic component 5 is passed through the opening. Therefore, the paper mask 4 is peeled from the printed board 1 without breaking. Then, the printed board 1 is washed with pure water. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007027227-A |
priorityDate | 1995-03-09^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635 |
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