| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32b73f2a07503cf315ed7a18af910158 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2035-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A24F40-46 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A24F40-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A24F40-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A24F40-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B3-14 |
| filingDate |
1994-06-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee06e7d20b74ea77ab26b6b37b8d26ea |
| publicationDate |
1996-02-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0855672-A |
| titleOfInvention |
Semiconductor electric heater and manufacturing method thereof |
| abstract |
(57) [Abstract] [Objective] A method for mechanically and electrically joining a metal material and a semiconductor material is disclosed. The method according to the invention is used, for example, for the formation of semiconductor heaters, in particular for use in electric smoking articles. A metal element 2 such as a copper alloy power supply metal piece is laser welded to a semiconductor element 1 such as a doped silicon resistance heater element. The laser beam L is directed through the hole 3 in the copper alloy piece to melt the silicon material 5, and the melted silicon material flows into the hole in the copper piece and reacts and mixes with the copper to form a slag containing copper silicide. Solidify as you do. If desired, a protective material such as nickel may be used to protect the copper alloy from oxidation. A low resistance ohmic contact and a high strength joint are provided between the parts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11154095-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11406139-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013524835-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11758949-B2 |
| priorityDate |
1993-06-08^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |