| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f0bc4f3462f5457c6dd1d30d2afe6a54 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02 |
| filingDate |
1995-03-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cd272a5f96effd942dba4e86c85a4fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f7a81e011359319ac490233aa80277f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7569d4c0db0d07e75b110af2cd0d4246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59744206da6510f5d7c1f9ad257ed06e |
| publicationDate |
1996-01-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H088283-A |
| titleOfInvention |
Substrate-using packaged electronic device and method of manufacturing the same |
| abstract |
(57) [Summary] (Modified) [Purpose] A standard two-piece mold is used to efficiently and highly reliably enclose electronic devices mounted on a substrate in a package. [Structure] A new degate (resin deburring) region is formed on the surface of a substrate to enable removal of an excess encapsulant formed during a molding process without damaging the device. The material of the degate area that contacts the inclusion body is Weak adhesion between the encapsulant and the encapsulant relative to that between the encapsulant and the substrate is exhibited, so that the detachment of the encapsulant from the degated region can occur without damage to the substrate or other parts of the device. The degation region can be formed without adding an additional step to the device formation process. The provision of the degation region makes it unnecessary to use a three-part or modified two-part mold to achieve top-side gating for degating without damaging the device. In one embodiment, the degate region is formed of gold. The adhesion force of gold between a normal encapsulant and the ordinary encapsulant is about 10% of the adhesive force between the ordinary encapsulant material and the substrate material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9110017-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9638662-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170005-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008529009-A |
| priorityDate |
1994-03-16^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |