| abstract |
(57) [Summary] [Purpose] This is a wiring structure that is used in SCE (Surface Conduction Electron Emission Element) type flat panel displays, etc., and undergoes a heat treatment process in the air after its construction. (EN) Provided is a wiring structure in which surface oxidation and resistance value increase do not occur even by a heat treatment process. [Structure] A conductive matrix 3 made of copper, and an adhesion layer 2 made of chromium or the like interposed between the conductive matrix 3 and the glass substrate 1. And a protective layer 3 made of chromium or the like for covering the entire exposed portion of the conductive mother body 3. This wiring structure is, for example, The adhesion layer and the conductive matrix are formed by a lift-off method, and thereafter, by forming a protective layer with a pattern wider than the wiring pattern of the adhesion layer and the conductive matrix, or after forming the adhesion layer and the conductive matrix, It is manufactured by forming the protective layer by a plating method. |