| abstract |
(57) Abstract: In a multi-chip module, reliability is improved, mounting defects are reduced, miniaturization is possible, and line transmission loss is reduced. A microstrip line is formed of tungsten 6 / nickel 7 / copper 8 on an aluminum nitride substrate 5. For further chip mounting, A nickel 9 / gold plating 10 layer is formed only in the mounting area, and the area other than the mounting area is covered with the resist 11. With such a configuration, it is possible to reduce the loss of solder, which is a problem at the time of mounting, to increase the mounting density, to reduce the size, and to reduce the line loss. |