http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09232260-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
filingDate 1996-02-22^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98e6a59c7bd6f23275acd05094dddfff
publicationDate 1997-09-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09232260-A
titleOfInvention Polishing plate, manufacturing method thereof and polishing method
abstract (57) Abstract: When chemical mechanical polishing is applied to a planarization process of an interlayer insulating film, it is possible to eliminate the step of the interlayer insulating film generated in a region where wiring intervals are sparse and to planarize it. However, it was difficult because the polishing cloth was elastically deformed due to the influence of the step during polishing. SOLUTION: A polishing plate 11 is used in place of a polishing cloth, and this polishing plate 11 is used for polishing in which a wafer 21 is slidably contacted while a polishing liquid is supplied to flatten a sliding contact surface of the wafer 21. There, a dispersion medium 12 made of a solid material and polishing abrasive grains 13 dispersed in the dispersion medium 12, the dispersion medium 12 is made of hydrocarbon, the polishing abrasive grains 13 is a metal oxide. Of metal carbonates, metal sulfates, metal nitrates, metal halides, metal silicates, metal borates, metal phosphates, metal arsenites, ammonium salts and silicon compounds It consists of at least one of them.
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priorityDate 1996-02-22^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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