| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16L58-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16L58-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32 |
| filingDate |
1996-04-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61c6a0c8340c628f7439bbb5f61d3bd7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b30270607c627eb8ae584c9815c942a |
| publicationDate |
1997-10-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09279356-A |
| titleOfInvention |
Inner plating copper tube |
| abstract |
(57) Abstract: [PROBLEMS] To provide an inner surface plated copper pipe having a coating layer excellent in peeling resistance and corrosion resistance. SOLUTION: N having a film thickness of 0.1 to 20 μm is formed on the inner surface of a copper tube 1. i coating layer 2 is formed, and Sn having a film thickness of 0.1 to 3 μm is formed thereon. The coating layer 3 is formed to form an inner surface plated copper tube. |
| priorityDate |
1996-04-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |