| abstract |
(57) [Summary] [PROBLEMS] To achieve significantly higher planarization than before in the microelectronics industry. The polishing is performed using a slurry containing abrasive particles and exhibiting a normal stress effect. The slurry also contains non-abrasive particles, and the polishing rate in the concave portions decreases, whereas the abrasive particles in the convex portions maintain the polishing speed high. [Effect] By this, flatness is improved. |