| abstract |
(57) [Summary] [Problem] Even if heat treatment is performed during the manufacture of a flexible printed circuit board (FPC), F is unlikely to cause thermal deformation and deterioration of peelability and does not contaminate the surface of a product FPC. Provision of a reinforcing sheet for holding a PC. SOLUTION: The reinforcing sheet for holding an FPC, comprising an adhesive layer and a base material layer, wherein the Young's modulus of the base material layer is 5000 kg. f / cm 2 or more, the adhesive layer is a vinyl chloride resin and the resin 1 A soft vinyl chloride resin layer having a thickness of 0.05 to 0.3 mm containing a plasticizer of 45 to 100 parts by weight per 00 parts by weight, and having a peel strength at room temperature of 1.5 to 10 gf / cm (to polyimide film, PIA of JIS C6472), peel strength after heat treatment under hot press conditions of 165 ° C. × 10 kgf / cm 2 × 30 minutes is 1.5 to 30 g. f / cm laminated sheet. |