http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11130451-A

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2204-08
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03B20-00
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filingDate 1997-10-31^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9c18023a40e562a5543104d3c8544a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57d10e165e4e8f154f4a273fee577bdb
publicationDate 1999-05-18^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11130451-A
titleOfInvention Quartz glass jig for semiconductor heat treatment equipment
abstract (57) [Summary] (with correction) [PROBLEMS] To provide a quartz glass jig for a semiconductor heat treatment apparatus having no microcracks and having fine irregularities on the surface. The invention relates to a jig made of quartz glass, the surface average surface roughness R a 0.1-2 .mu.m, the maximum roughness R max 1 10 μm to 10 μm, no microcracks, no change in average surface roughness of 0.1 μm / hour or less when washed with 5% hydrofluoric acid solution, and change in maximum roughness R max of 1 μm / hour A quartz glass jig for a semiconductor heat treatment apparatus, wherein a surface area increase rate is 100% or less.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4539794-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004051724-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002104843-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009260061-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6706205-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111606573-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1193327-A1
priorityDate 1997-10-31^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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