| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32681f1832d227fe8df23d12a37f67a8 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16L9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16L58-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16L58-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16L9-02 |
| filingDate |
1998-01-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8575ac60cd0d6b93257fc1daa4d7dba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d059138713bfc2927a3450a2ad600d77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_478a11f0494352dd0cf97c65b47feb58 |
| publicationDate |
1999-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H11201337-A |
| titleOfInvention |
Lead-containing copper alloy water supply equipment with reduced lead elution |
| abstract |
PROBLEM TO BE SOLVED: To provide a lead-containing copper alloy water-supply device in which lead is prevented from being eluted from a water passage surface of a water-supply device such as a lead-containing copper alloy faucet fitting. A water passage of a lead-containing copper alloy water supply device is plated. Plating can be performed by electroless plating, and nickel plating and copper plating are suitable as plating. |
| priorityDate |
1998-01-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |