| abstract |
[PROBLEMS] To mount a semiconductor integrated circuit, it is possible to mount the semiconductor integrated circuit at an extremely high density, to take a high-performance cooling structure, and to manufacture the semiconductor integrated circuit by a different device process technology. It is an object of the present invention to provide an electronic component capable of mounting a chip, a passive component, or an optical component in a small area, and a mounting method thereof. SOLUTION: A semiconductor chip is mounted on a silicon wafer substrate, an insulating film is formed on the silicon wafer substrate, and a through hole is provided in the insulating film corresponding only to an electrode pad portion of the semiconductor chip. A wiring pattern is formed by depositing a conductive film on the substrate and forming a pattern on the conductive film. |