| abstract |
PURPOSE: Titled composition, excellent in thermal rigidity and heat resistance, and suitable for the insulation of electrical parts, which comprises a specified epoxy resin, fused silica, an imidazole compound, and dicyandiamide. n CONSTITUTION: (A) 100pts.wt. an epoxy resin, composed of at least 70wt% a polyhydric phenol polyglycidyl ether and not more than 30wt% a polyepoxy compound, is compounded with (B) 50W1,000pts.wt. fused silica of particle size ≤80 mesh, (C) 0.01W0.1mol, per equivalent of (A), of an imidazole compound as a curing agent [e.g.; 2-methylimidazole, 2,4-diamino-6-[2-methylimidazole-(1)]- ethyl-S-triazine], and (D) 0.5W5pts.wt. dicyandiamide as a cocuring agent. The composition cures at 100W300°C, and gives a cured product, having coefficient of thermal expansion of 2.5×10 -5 /deg. n COPYRIGHT: (C)1980,JPO&Japio |