http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S5774178-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_930d026de3a6f8109fa00a85852fe8e4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3405 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-345 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-335 |
| filingDate | 1980-10-29^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858402034e673a9438bfea48111abbeb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe57c5af6b11062061e1b46efad6b6e5 |
| publicationDate | 1982-05-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S5774178-A |
| titleOfInvention | Lead wire leading structure for heat sensitive recording head and manufacture thereof |
| abstract | PURPOSE:To simply connect the terminal of a heat sensitive recording head to a connection cable by forming lead wires with photoresist on an insulating substrate, forming a spacer between the lead wires, and then soldering the surfaces of the lead wires. CONSTITUTION:A photoresist 8 is coated on a copper foil 7 bonded on a flexible insulating substrate 4, is partly irradiated with a light to be cured and developed, the foil 7 is then selectively etched, and lead wire pattern photoresist 8a and lead wire 7a are remained on the substrate 4. Epoxy resin 11 is buried to the same height as the photoresist 8a in the gap between the lead wire patterns, is cured, and the photoresist 8a is separated. Then, a thin solder layer 12 is formed on the lead wire 7a made of the copper wire, the terminal end of the cable is turned upside down, is then superposed on the terminal substrate 1 of the heat sensitive recording head, the entirely is heated to melt the layer 12, and the lead wire 7a is connected to a leading conductor 2. |
| priorityDate | 1980-10-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 |
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