http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S604832-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01K7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01K1-18 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01K7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-04 |
filingDate | 1983-06-23^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf113fd8e05f098816ebc5752bf97a84 |
publicationDate | 1985-01-11^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-S604832-A |
titleOfInvention | Temperature sensor |
abstract | PURPOSE:To obtain a temperature sensor excellent in the heat response and the detection capability by filling the gap between a detection element such as thermistor and the case inner wall thereof with a resin mixed with a metal powder in such an amount as not to let the insulation resistance below a specified value to improve the heat conductivity. CONSTITUTION:Electrodes 3 and 3 are provided on both sides of a temperature detection element 2 such as thermistor after lead terminals 4 and 4 are connected thereto, placed into a metal case 1 (replaceable with a porcelain case). The gap between the case 1 and the element 2, the electrodes 3 and 3 and the terminals 4 and 4 is filled with a an epoxy resin or a silicon resin 15 mixed with a fine powder 16 of metal such as Al, Ni and Ag with the particle size of about 0.5mum so as not to led the insulation resistance below 100MOMEGA. Prior to the mounting of the element 2 and the electrodes 3 and 3 into the case 1, the coating of an insulation resin 17 containing none of said powder 16 may be done thin to improve the insulability. This can better the heat conductivity of the insulation resin to obtain a sensor excellent in the sensitivity. This can better the heat conductivity of the insulation resin to obtain a sensor excellent in the sensitivity with a high response speed. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015509287-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008135718-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8814428-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2822543-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2836549-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6829820-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6639505-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1988374-A1 |
priorityDate | 1983-06-23^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 |
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