http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63244746-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f42544f6b8a2c962c3b35d4bb3542bd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02 |
| filingDate | 1987-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9e7485cbc7018382328feb2be8a7210 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_503b5ec820e3eb8b8a23351125da170a |
| publicationDate | 1988-10-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-S63244746-A |
| titleOfInvention | Resin sealing device |
| abstract | PURPOSE: To make the film thickness even while reducing the dispersion in products by a method wherein an element to be sealed is vibrated by a vibrating part while the liquid surface of resin solution is flattened by a squeegee. n CONSTITUTION: Fixing holes 20d are engaged with bumps formed into a jig plate 32 to install a hybrid IC 20 on a device and when the vibrating hybrid IC 20 is immersed in silicon resin solution A into the part encircled by broken lines by the vibration of vibrating sheet 13 and a desending vibrating part 1, the vibrating part 1 stops desending to hold the vibrating hybrid IC 20 in the silicon resin solution A for specified time and then said IC 20 is slowly picked out of the solution A to lift the vibrating part 1 up the the original position. At this time, a squeegee slider 51 is driven by a squeegee driving motor 5 to be shifted rightward on a squeegee slide shaft 54 so that the end part of squeegee 6 may flatten any projection formed on the liquid surface of silicon resin solution A. n COPYRIGHT: (C)1988,JPO&Japio |
| priorityDate | 1987-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
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