| abstract |
The porous film having chemical resistance according to the present invention is a porous film in which a porous film substrate is coated with a chemical-resistant polymer compound, and there are a large number of micropores having communication properties. The average pore diameter of the pores is 0.01 to 10 μm. Examples of the chemical resistant polymer compound include phenolic resins, urea resins, melamine resins, benzoguanamine resins, polyimide resins, epoxy resins, benzoxazine resins, polypropylene resins, polyurethane resins, and fluorine resins. Resin, alkyd resin, cellulose acetate resin, phthalic acid resin, maleic acid resin, silicon resin, and the like can be used. |