| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-466
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02258
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 |
| filingDate |
2005-10-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-05-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2006046676-A1 |
| titleOfInvention |
Electronic circuit board and manufacturing method thereof |
| abstract |
The method of manufacturing an electronic circuit board includes a pattern process for forming a conductor pattern capable of anodization on each of the substrates and a distribution pattern connected to the conductor pattern, and contacting the chemical liquid on the conductor pattern and the distribution pattern. An anodic oxidation step of conducting anodization while energizing them as an anode and generating an oxide film from the conductor pattern and the distribution pattern, and the width or thickness of the distribution pattern depends on the distribution pattern in the anodic oxidation step At least partially, the insulating film is formed so that the oxide film formed on one side wall is integrated with the oxide film formed on the other side wall. |
| priorityDate |
2004-10-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |