http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2006057385-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2005-11-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-06-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2006057385-A1 |
| titleOfInvention | Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board, and semiconductor element |
| abstract | The photosensitive resin composition of the present invention comprises (A) a polymer having a carboxyl group, (B) a hexaarylbiimidazole compound having no halogen atom, (C) a hydrogen donating compound, and (D) an acryl group or a methacryl group. The photopolymerizable compound which has this. According to the present invention, it is possible to satisfy both a sufficiently high photosensitivity and a sufficiently high resolution at the same time even if the component such as a photopolymerization initiator does not have a halogen atom, and a cured product. Can provide a photosensitive resin composition sufficiently excellent in solder heat resistance. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011043565-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010256718-A |
| priorityDate | 2004-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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