http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008066101-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2007-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-03-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008066101-A1 |
| titleOfInvention | Photosensitive thermosetting resin composition and flexible printed wiring board |
| abstract | Halogen-free, high-level flame retardancy, low warpage after curing, and alkali development type photosensitive thermosetting that can form films with excellent plasticity, resolution, solder heat resistance, chemical resistance, etc. Type resin composition and flexible printed wiring tochi using the same are provided. (A) a resin component having a (meth) acryloyl group and a carboxyl group in one molecule and soluble in a dilute alkaline solution; (B) a phosphorus-containing epoxy thermosetting resin component; and (C) initiation of photopolymerization. In comparison with a photosensitive thermosetting resin composition containing an agent, (D) an organophosphorus compound, and (E) a diluent, and using a conventional brominated epoxy resin and a halogen-based flame retardant, An alkali-developable photosensitive thermosetting resin composition having excellent properties that it has no inferior properties and does not generate hydrogen bromide, which has been a problem during combustion, and a flexible printed wiring board using the same. |
| priorityDate | 2006-12-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 230 of 230.