http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008084673-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0789 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2007-12-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-04-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008084673-A1 |
| titleOfInvention | Semiconductor device and manufacturing method thereof |
| abstract | In semiconductor devices where mounting components such as semiconductor packages and electronic elements are soldered to printed circuit boards using lead-free solder, microvoids in the solder joints that occur during heat aging are suppressed, and the impact rupture resistance of the solder joints is improved. Provided is a semiconductor device. In the assembly process of electronic parts such as semiconductor devices, when soldering a mounting member to a printed circuit board using lead-free solder, the printed circuit board is immersed in an organic acid-containing liquid heated to 60 ° C. or higher and 300 ° C. or lower. An oxide layer on the surface of the copper land is removed to a predetermined thickness or less to activate the cleaning, and an anti-oxidation protective film by the organic acid is formed on the surface of the cleaned copper land, and the printed circuit board and the predetermined A lead-free solder layer in which oxygen is present below a predetermined concentration is brought into close contact with the surface of the copper land, the solder interface, and the solder layer. The mounting member is soldered via the lead-free solder layer. |
| priorityDate | 2007-01-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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