http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008149937-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2008-06-05^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-08-26^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008149937-A1 |
| titleOfInvention | Polishing pad and polishing method for device wafer |
| abstract | Provided is a polishing pad for a device wafer, which improves the uniformity of the conductive layer of the device wafer in the wafer surface and enables stable electrochemical mechanical polishing for a long period of time. All the electrolyte solution storage portions F from the inner diameter side to the outer diameter side are set to w (mm) in the radial direction of the opening portion of the electrolyte solution storage portion F, and the maximum installation radius of the electrolyte solution storage portion F is set to R (mm). ) Is disposed on the polishing pad 60 so as to satisfy the relational expression of 45 / SQRT (R) <w <73 / SQRT (R). |
| priorityDate | 2007-06-05^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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