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filingDate 2010-11-10^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-04-04^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2011058996-A1
titleOfInvention Adhesive composition, semiconductor device using the same, and manufacturing method thereof
abstract An adhesive composition containing a radiation polymerizable compound, a photoinitiator, and a thermosetting resin and used for bonding a semiconductor chip. When the adhesive composition forming the adhesive layer is B-staged by light irradiation, the tack force on the surface of the adhesive layer is 200 gf / cm 2 or less at 30 ° C. and 200 gf / cm 2 or more at 120 ° C. is there.
priorityDate 2009-11-13^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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