abstract |
An adhesive composition containing a radiation polymerizable compound, a photoinitiator, and a thermosetting resin and used for bonding a semiconductor chip. When the adhesive composition forming the adhesive layer is B-staged by light irradiation, the tack force on the surface of the adhesive layer is 200 gf / cm 2 or less at 30 ° C. and 200 gf / cm 2 or more at 120 ° C. is there. |