| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2013-08-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-07-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2014024804-A1 |
| titleOfInvention |
Photosensitive resin composition for permanent mask resist, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| abstract |
The present invention includes (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, and (C) a nitroxyl compound, and (C) the nitroxyl compound includes a compound having a specific structure. A photosensitive resin composition for a permanent mask resist is provided. |
| priorityDate |
2012-08-06^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |