| abstract |
The first bond portion is formed on the first electrode, and the tip of the capillary (C) is formed on the bump (B) formed on the second electrode with respect to the wire (6) wired from the first bond portion. To form a second bond part (62) to which the shape of the pressing surface (S1) at the tip of the capillary (C) is transferred. The base end (P1) of the second bond portion (62) where the wire (6) starts to become thin is made to enter the bump (B) side from one end P21 by 10% or more with respect to the length of the joining surface (S2). Then, the wire (6) is cut by the capillary (C). |