http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-0126135-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e70c0aeade92d7571d955d3b90ea06e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 1988-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1997-12-26^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0facade5ec6f95e63c63e9b9ece40fba |
| publicationDate | 1997-12-26^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-0126135-B1 |
| titleOfInvention | Method of manufacturing a multilayer printed circuit board |
| abstract | The present invention is directed to forming a conductive copper circuit component having a thickness of 4 microns or more on the surface of a dielectric layer support; (b) Applying a polyvalent metal that is less precious than copper to a copper circuit component, during or after application, such that the applied metal is converted onto the corresponding oxide, hydroxide or mixture thereof on its surface, thereby reducing the An oxide, hydroxide or mixture layer thereof is formed on the copper circuit component under conditions such that its thickness becomes 1.5 micron or less; (c) forming an adhesive organosilane coating on the surface of the oxide, hydroxide or mixture thereof formed in step (b) or on an insulating layer to be bonded to a copper circuit component comprising a partially cured thermosetting polymer composition; (d) repeating steps (a), (b) and (c); (e) the part formed during bonding by bonding the material formed by steps (a), (b), (c) and (d) to a single article such that the organic silane coating is between the oxide, hydroxide or mixtures thereof and the insulating layer. Allow the cured insulating layer to cure; (f) forming a plurality of holes through the joined article formed in step (e); (g) subject the multilayer printed circuit board to prevent delamination when exposed to thermal stress at 288 ° C. (550 ° F.) for 10 seconds after preliminary baking at 135 to 149 ° C. (275 to 300 ° F.) for 2 hours. Conducting through-holes through a plurality of insulating and dielectric layers to electrically connect the series of electrically conductive layers, thereby forming a multilayer circuit board by metallizing the walls of the through-holes to form electrically conductive passageways from the holes opposite the through-holes. The present invention relates to a method for manufacturing a multilayer printed circuit board containing the article and an article produced thereby. |
| priorityDate | 1987-10-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Showing number of triples: 1 to 75 of 75.