| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecc6d1da5ee9b10329aa8213405b9ed0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S118-07 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3468
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-085 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| filingDate |
1992-02-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4ff8b329f4c947f124b46e78388963c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5220c9ffe886572cbd3043c7fdd1231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13e6d866726eb7bc31ace97ded92dfb0 |
| publicationDate |
1998-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-0139096-B1 |
| titleOfInvention |
Wave Soldering Machine with Protective Gas Hood on Solder Pot |
| abstract |
A short hood has been described that provides a protective gas as much as possible by covering the solder port of a soldering machine for wave soldering a printed circuit board. Other operating areas of the soldering machine are exposed to the atmosphere. The inlets and outlets of the printed circuit board are provided on the hood and covered by a conductive film made of a thin, thin metal material in the vertical direction. The soldering method according to the invention uses a thin layer of no-clean solvent and allows up to 5% oxygen content in the protective gas. |
| priorityDate |
1991-02-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |