http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-0176435-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82b66a96b0b968c81561d0513719deec |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 1996-01-18^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1999-05-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd8a7605aff4209b23b86387cf5cd1fa |
| publicationDate | 1999-05-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-0176435-B1 |
| titleOfInvention | Metal bonding method |
| abstract | The present invention relates to a metal bonding method.n n n The metal bonding method includes plating a printed circuit board pattern connection part to be bonded, plating an outer lead of the lead frame to be bonded, and fixing and bonding the pattern connection part of the printed circuit board and the outer lead of the lead frame by applying hot air at a melting point or higher. It can reduce the short circuit caused by the solder, and because the tip serves to fix the defect does not occur, the lead is not lifted. |
| priorityDate | 1996-01-18^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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