http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100189646-B1

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filingDate 1990-04-16^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-06-01^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64e1c7495e93a7b4c61abc88775f3a70
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publicationDate 1999-06-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100189646-B1
titleOfInvention Method and apparatus for heating / cooling semiconductor wafers
abstract Solvent-free epoxy resin curable cationicly,n n n 0.01 to 5 weight percent of a triarylsulfonium salt having hexafluoro phosphate, hexafluoro arsenate or hexafluoroantimonate as an anion, based on the weight of the epoxy resin, andn n n 0.01-5% by weight of a benzyl thiolanium salt with hexa fluoro phosphate, hexafluoro arsenate or hexafluoro antimonate as an anion, based on the weight of the epoxy resin, and alson n n A reaction resin mixture, optionally comprising a standard additive, is used and the reaction resin mixture is cured by UV radiation and by heat, wherein the reaction resin mixture is cured by UV radiation and by heat. will be.
priorityDate 1989-05-08^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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