http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100258802-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65e3e8d2bb1c079b667311ac4f19d12b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B47-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B47-20 |
| filingDate | 1995-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2000-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63887d3ab90a0236ffb247f0af6a22aa |
| publicationDate | 2000-06-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100258802-B1 |
| titleOfInvention | Flattening device and flattening method using the same |
| abstract | The present invention relates to a planarization apparatus and a planarization method using the same, comprising: thermal expansion means made of a material having a low thermal expansion coefficient on an upper portion of a pedestal; Blocking means for preventing heat from being released to the side, a table provided in the thermal expansion means, cooling means for circulating cooling water inside the table to cool the heat transferred from the thermal expansion means, and a porous portion provided at the top of the table. A pad made of a material for selectively polishing a contact portion of the surface of the semiconductor substrate, an abrasive material supply means for supplying an abrasive material to the surface of the pad, and an upper portion of the semiconductor substrate fixed to be in contact with the pad A holder for rotating and a motor for driving the holder, the semiconductor Forming a predetermined conductive pattern on the substrate, forming an insulating layer thicker than the conductive pattern on the semiconductor substrate on which the conductive pattern is formed, and contacting the upper surface of the semiconductor substrate with a pad of the planarization apparatus. Selectively grinding only the convex portions of the insulating layer formed on the conductive pattern while the thermal expansion means is fixed in a state to flatten the surface. Accordingly, only the convex portions of the insulating layer formed on the conductive pattern of the semiconductor substrate are selectively finely polished so that there is no step difference, thereby improving the flatness of the surface. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100835517-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100413493-B1 |
| priorityDate | 1995-02-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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