| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate |
1997-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_052ae5fa069c78f6a030ab9cc63c7d94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b646fb9d64816d900c2612230aab3b33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a5480bc83aacf17ad3618c73eb73bf3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7056ea2116fc4350f29c75a11f0ae4f9 |
| publicationDate |
2000-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100263663-B1 |
| titleOfInvention |
Resin composition and semiconductor device employing the same |
| abstract |
The present invention relates to a resin composition and a semiconductor device using the same,n n n The said resin composition is comprised from the hardening | curing agent containing the (a) epoxy compound, (b) polysiloxane resin which has a phenolic hydroxyl group in a side chain, and (c) an inorganic filler. It is characterized by the above-mentioned. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100920276-B1 |
| priorityDate |
1996-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |