| abstract |
The present invention discloses a ball grid array package and a method of manufacturing the same. According to the present invention, a U-shaped groove 11 is formed in a semiconductor chip 10 having a circuit, and a pair of bonding pads 20 and insulating pads 30 are formed at the center and both sides of the bottom surface of the groove 11. Is formed. Each pad 20, 30 is connected by a metal wire 40, and the encapsulant 50 molds the inside of the groove 11. At this time, the middle portion of the metal wire 40 protrudes from the encapsulant 50, the bump 60 is attached to the protruding metal wire 40, and the solder ball 70 mounted on the substrate is bump 60. ) Is attached. Therefore, since the encapsulant 50 does not protrude from the semiconductor chip 10, the thickness of the semiconductor chip 10 immediately becomes the thickness of the package, thereby making the package thinner. |