| abstract |
A plurality of circuit parts having an internal terminal and an external terminal integrally arranged in a substantially one plane in two dimensions, each independently electrically independent of each other, the circuit portion has a lead for integrally connecting the internal terminal and the external terminal, The surface side is a semiconductor element mounting surface in which the inner terminal, the lead and the outer terminal form one plane, and the inner terminal and the lead are thinner than the outer terminal, and the terminal surface of the inner terminal and the terminal surface of the outer terminal are provided on the back side of the circuit section. The semiconductor element is mounted on the surface of the terminal side of the semiconductor element on the semiconductor element mounting surface of the circuit portion via an insulating layer, and electrically connects the terminal of the semiconductor element and the terminal face of the internal terminal with a wire, and connects a part of the external terminal. Since the resin is sealed to be exposed to the outside to form a resin sealed semiconductor device, the semiconductor device has a high occupancy rate in the semiconductor device. Therefore, the semiconductor device can be miniaturized, the mounting density of the circuit board can be improved, and the external electrode is formed at the external terminal, not to mention the pinching, which was difficult for a small semiconductor device such as a conventional TOSP. Done. |