http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100334740-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05D22-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F24F3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F24F3-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F24F3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G05D22-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F24F3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F24F3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F24F3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F24F6-12 |
| filingDate | 1999-06-29^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2002-05-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2002-05-04^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100334740-B1 |
| titleOfInvention | Method and apparatus of temperature humidity controller for semiconductor equipment |
| abstract | The present invention relates to a method for supplying a constant temperature and humidity air for a semiconductor device and a device using the method, the method comprising the steps of introducing a process air; Performing dehumidification and humidification at the same time by passing the incoming air through the sprayed water; Heating the dehumidified and humidified air; Exhausting the heated air to a semiconductor facility, the apparatus comprising: a housing; An air suction pipe forming a passage through which process air is sucked and having a nozzle unit for injecting air into the housing; Water supply means for supplying water to the inside of the housing to simultaneously perform dehumidification and humidification while the air injected into the inside of the housing through the nozzle portion of the air suction pipe collides with water molecules; Cooling means for cooling the water of the water supply means to a dew point temperature; Heating means for heating the air dehumidified and humidified by the water supply means to a predetermined temperature; And an air discharge pipe for supplying air heated by the heating means to the semiconductor equipment side. Accordingly, the energy loss generated in the multi-step process can be reduced, the error of the whole system can be minimized, and the stable operation can be performed. The configuration of the device is simple to minimize the failure, the energy consumption required for heating, and the stability of the control. Can be increased. |
| priorityDate | 1999-06-29^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962 |
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